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2008年6月6日
IBM演示3D堆叠内部水冷芯片
IBM实验室和柏林弗劳恩霍夫研究院（Fraunhofer Institute）合作，日前向外界展示了一款采用3D堆叠技术，并在芯片内部实现直接水冷散热的原型芯片。该芯片使用3D堆叠技术，将原本水平排列的半导体电路一层一层的堆叠在芯片封装当中，可大大提高半导体芯片内的晶体管数量，同时可将信号在芯片内的传输距离缩短1000倍，芯片内部传输通道扩展100倍。
Tags: IBM 水冷
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